SEMICON Singapore 2014 Forums

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SEMICON Singapore 2014 will take out more over 40 hours of technical and business sessions over the 3 days. For more information on these programs including speakers, dates, times and registration - View the Schedule at a Glance.


Market Trends Briefing (1a)

The Market Trends Briefing will provide a comprehensive overview of the current market trends, challenges, and opportunities shaping the microelectronics industry. 

Fabless/IDM Technology Challenges (1b)

Hear from some of the industry leaders including ones from Broadcom, Intel, Silicon Laboratories and Xilinx on the emerging industry dynamics that are paving way for new biz and growth opportunities in the Mobility and IoT space as well as the associated challenges - and with additional emphasis on what and how these perspectives relate to the Singapore semiconductor landscape.

Advanced Packaging Technology Forum (1c)

This session will provide the latest insights & technology trends for flip chip, wire-bond & silicon photonics. In this forum, experts from the leading fabless, foundry, assembly houses, equipment makers, materials vendors and research institute will address the packaging challenges in the implementation of next generation devices such as FinFET, 28nm/20nm logic nodes to enable mobility for the Internet of Things (IoT).

Failure Analysis Forum & Yield Productivity (1d)

In this forum, we will address the issues and challenges faced in the advanced technologies, and perspectives from original equipment manufacturers.

2.5D/3D-IC Forum (2a)

In the past few years, advances in Silicon fabrication, Assembly, Packaging technologies have driven the realization of products using 2.5D, 3D IC technology.  Companies in logic, memory and imaging space are designing and manufacturing products using 2.5D, 3D IC technology.   The next phase in the path to high volume manufacturing is the optimization of cost-effective approaches to heterogeneous integration.  Interconnect design, fabrication, assembly and packaging of 2.5D/3D ICs need to be optimized to be cost effective for the end applications.   Such optimization for 2.5D/3D ICs involves the entire supply chain from system architects to materials developers.  That is the focus of this year’s 2.5D/3D ICs forum. 


For the industry to successfully adapt to the performance and cost demands of 2.5D/3D ICs, anticipate and address challenges encountered in high volume manufacturing, this forum brings together leading Industry/Market Analysts, System manufacturers, Fabless companies, University, IDM, Foundry, OSAT, Equipment manufacturers and Materials companies to share their knowledge and insights. 

LED Technology Forum (2b)

This forum provides a platform for professionals from manufacturing industry and research academia to share the state-of-the-art techniques in the LED lighting development, to explore the potential prospects and challenges of the expansion of the solid state lighting, as well as to establish research and business collaborations among different parties.

Emerging Growth Companies (EGC) Summit (2c)

OIOT and M2M communications markets are driving significant innovation resulting in many emerging growth companies. Exciting Singapore IOT areas include enterprise software, electronics, and semiconductor for markets including communications, mobile, security and payment, health and energy.

Product Test Forum (3a)

This forum will address the issues and challenges facing the Product Testing, with presentations and perspectives from original equipment manufacturers, device manufacturers, system assembly and test houses, and leading test supply chain companies. Speakers will address what changes and technologies are needed to achieve cost-effective test solutions for the next-generation of semiconductors.

MEMS Technology Forum (3c)

This forum addresses these challenges faced by inertial sensors by bringing together leaders in MEMS sensors, sensor fusion, monolithic sensor-ASIC integration, and inertial sensor application development. 

Packaging & Test SEMI Standards Workshop (WLP/3D IC)

This SEMI Standards Workshop focuses on the manufacturing standardization issues faced in packaging and test.